ITO sputtering target for tin oxide powder, method of manufacturing the same powder, method of manufacturing the same target and the ITO film for forming a sintered sputtering target

摘要

ITO sputtering target for tin oxide, characterized in that it is in the range of particle size of 90% as determined from the particle size distribution median diameter was determined from the particle size distribution is in a range of 0.40~1.0μm is 3.0μm or less powder. And there is provided an ITO film forming sputtering target was sintered in a powder and tin oxide powder can be obtained a sintered body excellent in uniformity of the components with a suitable densification ITO thin film formation, To provide a low-cost indium oxide target - ITO film forming tin oxide which can suppress the deterioration of film quality and the accompanying nodules, etc., that occur in ITO thin film formation by this.