PROBLEM TO BE SOLVED: To connect a bump-less IC chip with the terminal of a circuit board at low costs, by using an anisotropic conductive bounding material, and to maintain the high operation stability of the IC chip. ;SOLUTION: A bump-less chip IC1 in which an organic insulating film 6 is formed on a passivation film 4 and a circuit board 10 are connected by an anisotropic conductive bonding material 20 including hard conductive particles 23, at least whose surfaces are metal in this bare chip mounting structure. It is desired that the hardness of the hard conductive particles 23 is 300 kgf/mm2 or more as compressed hardness K value.;COPYRIGHT: (C)2000,JPO
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机译:解决的问题:通过使用各向异性导电限制材料以低成本将无凸点IC芯片与电路板的端子连接,并保持IC芯片的高操作稳定性。 ;解决方案:无凸点芯片IC1(其中在钝化膜4上形成有机绝缘膜6)和电路板10通过各向异性导电接合材料20连接,各向异性导电接合材料20至少包含硬质导电颗粒23这种裸芯片安装结构。硬质导电性粒子23的硬度作为压缩硬度K值优选为300kgf / mm 2以上。COPYRIGHT:(C)2000,JPO
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