Heat resistance it is low formation manner of the dielectricity factor thin film, that heat resistance low the semiconductor equipment null which uses the semiconductor layer insulation film and this semiconductor layer insulation film which consist of the dielectricity factor

摘要

PROBLEM TO BE SOLVED: To provide a thin film that has improved heat resistance, has low dielectric constant, and can be applied to a semiconductor element, electrical circuit components, or the like. SOLUTION: This heat-resistance low dielectric constant thin film is composed of molecules, whose element symbols are B, N, and H, has a composition which satisfies 0.7 number of N atoms 1.3 and 1.0 number of H atoms 2.2 for one atom of B, and has a dielectric constant of 2.4 or less.