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Gold separable manner and update manner null of non electrolysis gold-plating

机译:非电解镀金的金分离方式和更新方式无效

摘要

PROBLEM TO BE SOLVED: To simply renew an electroless gold plating bath contg. soluble gold salt and a reducing agent at a low cost without recovering gold from the bath by reducing the pH of the bath and depositing and separating gold. ;SOLUTION: After the use of an electroless gold plating bath of pH about 12.5 to 14.0 contg. soluble gold salt such as kaU(CN)2 and a reducing agent such as dimethylamine borane, which is mixed with an acidic soln. such as an aq. soln. of sulfuric acid to reduce the pH thereof to ≤12.5. In this way, the reducing power of the plating bath is increased to deposite gold by approximately the total content. Next, the top part contg. no gold components is removed. The obtd. coarse gold is mixed with an oxidizing agent such as KCN and sodium nitrobenzenesulfonate, which is redissolved, thereafter, newly, the plating soln. or a replenishing soln. contg. required components other than gold is added, and new electroless plating bath is made up.;COPYRIGHT: (C)1997,JPO
机译:要解决的问题:简单地续用化学镀金液。通过降低浴液的pH值以及沉积和分离金,可以低成本地以低的价格溶解金盐和还原剂,而无需从浴液中回收金。 ;解决方案:使用pH值约为12.5至14.0的化学镀金浴后。将可溶性金盐(例如kaU(CN) 2 )和还原剂(例如二甲胺硼烷)与酸性溶液混合。如水溶液soln。硫酸以将其pH降低至12.5。以这种方式,增加了镀浴的还原能力,以使金沉积大约总含量。接下来,继续上半部分。没有去除任何金组分。奥特。将粗金与氧化剂(如KCN和硝基苯磺酸钠)混合,然后重新溶解,然后重新镀覆。或补水续添加金以外的必要成分,并制作新的化学镀浴。版权所有:(C)1997,日本特许厅

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