Preprocessing liquid and non electrolytic gold-plating manner for reduction die non electrolysis gold-plating

摘要

P To provide a method of stably performing electroless gold plating to an independent fine wiring propellent-actuated device part and to provide a pretreatment liquid for reduction type electroless gold plating used therefor. PSOLUTION: The pretreatment liquid for reduction type electroless gold plating is obtained by blending one or more kinds of components selected from a phenyl compound, an ascorbic acid compound and a hydrazine compound and a thiourea compound into an aqueous solution comprising at least one kind of component selected from the group consisting of sulfurous acid and the salt thereof and at least one kind of component selected from the group consisting of thiosulfuric acid and the salt thereof independently or in combination. PCOPYRIGHT: (C)2010 and JPO& INPIT