首页>
外国专利>
Non electrolysis gold-plating bath and non electrolytic gold-plating manner
Non electrolysis gold-plating bath and non electrolytic gold-plating manner
展开▼
机译:非电解镀金浴及非电解镀金方式
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: To surely form an excellent gold plated film without generating the spreading of plating by adding a nonionic surfactant and a nonionic polymer into an electroless gold plating bath as a stabilizer. ;CONSTITUTION: The nonionic surfactant and the nonionic polymer is added by 0.1-100mg/l into the electroless gold plating bath containing a water soluble gold compound, a complexing agent and a reducing agent as the stabilizer for preventing spreading of plating. The nonionic surfactant is selected from between a polyalkylene glycol, polyalkylene glycol type surfactant and the nonionic polymer is selected from between polyvinyl alcohol, polyvinyl pyrrolidone.;COPYRIGHT: (C)1994,JPO
展开▼