Makes the formation of the metal chemical compound thin film whose bulky dorotsupuretsuto is little possible the arc type ion plating device

摘要

PROBLEM TO BE SOLVED: To form a metallic compd. thin film small in coarse droplet number by an arc type ion plating method. ;SOLUTION: At the time of forming a metallic compd. thin film 6 by an arc type ion plating method in which a metallic particle group is vaporized from the surface of a metallic target 2 by arc discharge, this vaporized metallic particle group is converged by the magnetic force of ring-shaped electromagnets conentrically arranged along the outer circumference of the metallic target, is allowed to react with an atmospheric gas while passing through the inside of a vacuum chamber 1 and is deposited on the surface of a substrate, as the ring-shaped electromagnets, a primary ring-shaped electromagnet 4 is used, adjacently to this primary ring-shaped electromagnet, a secondary ring-shaped electromagnet A is concentrically disposed at a prescribed interval, by the magnetic force of this secondary ring-shaped electromagnet, coarse particles among the vaporized metallic particles group converged by the primary ring- shaped electromagnet are made fine, and the rectifying of the sizes of the evaporated metallic particle group is executed.;COPYRIGHT: (C)2000,JPO