THERMALLY DECOMPOSABLE ORGANIC POLYMER FOR FORMING CAVITY AMONG MULTILAYER WIRINGS

摘要

PROBLEM TO BE SOLVED: To obtain a thermally decomposable organic polymer for forming a cavity among multilayer wirings and a film made from the polymer, and more particularly to obtain a thermally decomposable organic polymer for forming a cavity among multilayer wirings, which polymer is capable of forming a cavity among metallic wirings in e.g. a semiconductor element because it has a specified heat resistant temperature and a specified heat decomposition temperature, and a film comprising the polymer. ;SOLUTION: The thermally decomposable polymer shows a weight loss of at most 5 wt.% when heated at 350°C for 1 hr in an inert gas or vacuum atmosphere and shows a weight loss of at least 80 wt.% when heated at 500°C for 1 hr in the atmosphere.;COPYRIGHT: (C)2004,JPO