Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process

摘要

Embodiments of the invention provide a method and formulations for preventing foam formation inside a plating apparatus prior to or during plating a material on a substrate. In one embodiment, a method for preventing foam formation inside a plating apparatus designed for plating a material on a substrate includes providing an electrolyte solution containing at least one antifoaming agent, at least one metal ion source, and a supporting electrolyte. The method further includes placing the substrate onto a substrate holder of the plating apparatus, immersing the substrate in the electrolyte solution, and depositing the material onto the substrate.