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H2O vapor as a processing gas for crust, resist, and residue removal for post ion implant resist strip
H2O vapor as a processing gas for crust, resist, and residue removal for post ion implant resist strip
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机译:H2O蒸气作为处理气体,用于去除结壳,抗蚀剂和残留物,用于离子注入后的抗蚀剂剥离
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摘要
H2O vapor is used as a processing gas for stripping photoresist material from a substrate having a patterned photoresist layer previously used as an ion implantation mask, wherein the patterned photoresist layer is defined by a photoresist crust covering a bulk photoresist portion. Broadly speaking, the H2O vapor is demonstrated to more efficiently strip the photoresist material having a cross-linked photoresist crust without causing the photoresist crust to pop and without causing the bulk photoresist to be undercut. Thus, H2O vapor provides a safe, efficient, and economical processing gas for stripping photoresist material having a photoresist crust resulting from an ion implantation process.
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