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Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding
Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding
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机译:堆叠式多芯片封装,芯片结构封装的制造工艺和引线键合工艺
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摘要
A stacked multi-chip package includes a substrate, a first chip and a second chip. The first chip is fixed to the substrate, and is provided with a collar portion which opposes an upper face of the substrate in a state such that a gap is formed between the upper face of the substrate and the collar portion. The second chip is disposed in a region below the collar portion. The second chip is fixed to the substrate and does not make contact with the first chip.
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