首页> 外国专利> CHEMICALLY AMPLIFIED PHOTORESIST AND PROCESS FOR STRUCTURING SUBSTITUENTS USING TRANSPARENCY ENHANCEMENT OF RESIST COPOLYMERS FOR 157 NM PHOTOLITHOGRAPHY THROUGH THE USE OF FLUORINATED CINNAMIC ACID DERIVATIVES

CHEMICALLY AMPLIFIED PHOTORESIST AND PROCESS FOR STRUCTURING SUBSTITUENTS USING TRANSPARENCY ENHANCEMENT OF RESIST COPOLYMERS FOR 157 NM PHOTOLITHOGRAPHY THROUGH THE USE OF FLUORINATED CINNAMIC ACID DERIVATIVES

机译:化学增强的光致抗蚀剂,以及通过使用荧光肉桂酸衍生物对157 NM的光刻胶进行透明性增强的抵抗性共聚物结构化取代基的方法

摘要

Chemically amplified photoresists exhibit increased transparency at a wavelength of 157 nm. The chemically amplified photoresist includes a polymer containing first repeating units derived from a cinnamic acid or a cinnamic ester, which are at least monofluorinated or substituted by fluoroalkyl groups. Processes for structuring substituents using transparency enhancement of resist copolymers for 157 nm photolithography using fluorinated cinnamic acid derivatives are also included.
机译:化学放大的光致抗蚀剂在157 nm波长处显示更高的透明度。化学放大的光致抗蚀剂包括含有衍生自肉桂酸或肉桂酸酯的第一重复单元的聚合物,所述第一重复单元至少被单氟化或被氟代烷基取代。还包括用于使用氟化肉桂酸衍生物的用于157nm光刻的抗蚀剂共聚物的透明性增强来构造取代基的方法。

著录项

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号