首页> 外国专利> Optically interconnecting integrated circuit chips

Optically interconnecting integrated circuit chips

机译:光互连集成电路芯片

摘要

An optical optical waveguide channel is formed in an intermediate layer of a printed circuit board (PCB) so that opto-electronic components on integrated circuit (IC) chips mounted on the PCB may be optically interconnected. At each end of the optical waveguide channel is an optical waveguide path perpendicularly extending from the end of the channel to a surface of the printed circuit board. An IC chip mounted on the PCB may include a die flip-mounted on a substrate. An optically transducing surface of the opto-electronic component is directed downward toward the substrate. Optical waveguide paths extend perpendicularly through the substrate, coupling with the optically transducing surfaces. The IC chips are mounted on the PCB, aligning the optical waveguide paths in the substrates with the optical waveguide paths in the PCB.
机译:光学光波导通道形成在印刷电路板(PCB)的中间层中,以便可以将安装在PCB上的集成电路(IC)芯片上的光电组件进行光学互连。在光波导通道的每个末端是从该通道的末端垂直延伸到印刷电路板表面的光波导路径。安装在PCB上的IC芯片可以包括倒装安装在基板上的管芯。光电组件的光转换表面朝下指向基板。光波导路径垂直延伸穿过基板,并与光转换表面耦合。将IC芯片安装在PCB上,使基板中的光波导路径与PCB中的光波导路径对准。

著录项

  • 公开/公告号US6736552B2

    专利类型

  • 公开/公告日2004-05-18

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号US20010898517

  • 发明设计人 ANDREW W. MARTWICK;

    申请日2001-07-03

  • 分类号G02B63/60;

  • 国家 US

  • 入库时间 2022-08-21 23:17:13

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号