CAD-oriented equivalent circuit modeling of on-chip interconnects for RF integrated circuits in CMOS technology

摘要

A CAD-oriented modeling methodology for coupled interconnects on lossy substrates in CMOS technology is presented. The modeling technique is based on a quasi-static EM analysis and an equivalent circuit model extraction and model-order reduction procedure. The response of the SPICE compatible equivalent circuit models is in good agreement with the frequency-dependent transmission line characteristics of the interconnects.