首页> 外国专利> Device substrate, production method therefor, electronic device, production method therefor, optic device, production method therefor, and electronic apparatus

Device substrate, production method therefor, electronic device, production method therefor, optic device, production method therefor, and electronic apparatus

机译:器件基板,其制造方法,电子设备,其制造方法,光学器件,其制造方法和电子设备

摘要

Object To provide a device substrate and a production method therefor, which device substrate has a film having a reflection function and can be formed by a production process that does not require a vacuum process inviting increased production cost. ;Solving Means A device substrate according to the present invention includes a substrate 1, an electronic element 2 mounted above the substrate 1, and a film 3 having a phase separation structure and arranged above the electronic element 2 so as to cover at least a part of the substrate 1 or the electronic element 2. Alternatively, the film 3 having a phase separation structure in the above configuration may be arranged below the electronic element 2. The film 3 having a phase separation structure can be arranged so as not come in contact with the substrate 1.
机译:目的提供一种器件基板及其制造方法,该器件基板具有具有反射功能的膜并且可以通过不需要真空工艺的制造工艺形成,从而增加了生产成本。解决方案根据本发明的器件基板包括基板 1 ,安装在基板 1 上方的电子元件 2 和膜。 3 具有相分离结构,并布置在电子元件 2 的上方,以覆盖基板 1 或电子元件的至少一部分 2 。或者,可以将上述结构的具有相分离结构的膜 3 配置在电子元件 2 的下方。具有相分离结构的膜 3 可以被布置为不与基板 1接触。

著录项

  • 公开/公告号US2004080920A1

    专利类型

  • 公开/公告日2004-04-29

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORPORATION;

    申请/专利号US20030639534

  • 发明设计人 TAKASHI MIYAZAWA;

    申请日2003-08-13

  • 分类号H05K1/03;H05K1/16;

  • 国家 US

  • 入库时间 2022-08-21 23:17:06

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