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Method for formation of semiconductor device pattern, method for designing photo mask pattern, photo mask and process for photo mask

机译:半导体器件图案的形成方法,光掩模图案的设计方法,光掩模和光掩模的工艺

摘要

A shielding film is formed on the surface of a substrate and a pair of aperture patterns for light transmission with substantially the same line width are formed in the above shielding film so as to run parallel to each other with a gap and to be isolated from other aperture patterns for light transmission. The exposure amount (exposure energy to sufficiently large aperture pattern) at the time a photoresist is exposed by using this photo mask is 4 or more times and 20 or less times as large as the exposure amount on the border where the photoresist is converted from soluble to insoluble through the exposure or the exposure amount on the border from insoluble to soluble. Thereby, it becomes possible to form a microscopic pattern without using an auxiliary pattern method or a phase shift mask and the default inspection of a mask can be made easy.
机译:在基板的表面上形成有遮蔽膜,并且在上述遮蔽膜中形成有一对具有大致相同的线宽的光透射用的开口图案,该一对开口图案彼此平行地隔开间隔并相互隔离。光传输的光圈图案。使用该光掩模对光致抗蚀剂进行曝光时的曝光量(对足够大的孔径图案的曝光能量)是光致抗蚀剂从可溶物转变成的边界上的曝光量的4倍以上且20倍以下。通过暴露或边界上的暴露量从不溶变为可溶而变为不溶。由此,可以在不使用辅助图案方法或相移掩模的情况下形成微观图案,并且可以容易地进行掩模的默认检查。

著录项

  • 公开/公告号US6706453B2

    专利类型

  • 公开/公告日2004-03-16

    原文格式PDF

  • 申请/专利权人 RENESAS TECHNOLOGY CORP.;

    申请/专利号US20020163458

  • 发明设计人 SHUJI NAKAO;

    申请日2002-06-07

  • 分类号G03F90/00;

  • 国家 US

  • 入库时间 2022-08-21 23:14:29

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