首页> 外国专利> Method for epitaxially growing crystalline insulation layer on crystalline silicon substrate while simultaneously growing silicon oxide, nitride, or oxynitride

Method for epitaxially growing crystalline insulation layer on crystalline silicon substrate while simultaneously growing silicon oxide, nitride, or oxynitride

机译:在晶体硅衬底上外延生长晶体绝缘层,同时生长氧化硅,氮化物或氮氧化物的方法

摘要

Metal which forms a crystalline insulation layer is sputtered at a target and deposited as a film on a silicon substrate, the metal is chemically combined with reactive gas around the silicon substrate to thereby grow a crystal layer of a crystalline insulation substance, and a voltage is applied to the substrate so that ions of the reactive gas around the substrate are attracted to a surface of the silicon substrate and chemically combined with silicon, whereby an insulation silicon compound layer is formed. As a result, a structure is obtained in which a crystalline insulation layer is formed on a crystalline silicon layer through an amorphous insulation film which is formed by a silicon compound which has an excellent insulation characteristic.
机译:形成晶体绝缘层的金属被溅射到靶上,并以膜的形式沉积在硅基板上,该金属与硅基板周围的反应气体化学结合,从而生长出晶体绝缘物质的晶体层,并且电压为施加到衬底上,使得衬底周围的反应性气体的离子被吸引到硅衬底的表面并与硅化学结合,从而形成绝缘硅化合物层。结果,获得了一种结构,其中晶体绝缘层通过非晶绝缘膜形成在晶体硅层上,该非晶绝缘膜由具有优异绝缘特性的硅化合物形成。

著录项

  • 公开/公告号US6683012B2

    专利类型

  • 公开/公告日2004-01-27

    原文格式PDF

  • 申请/专利权人 ROHM CO. LTD.;

    申请/专利号US20020190520

  • 申请日2002-07-09

  • 分类号H01L213/10;H01L214/69;C23C141/40;C23C141/60;C23C140/60;

  • 国家 US

  • 入库时间 2022-08-21 23:14:06

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