首页> 外国专利> Method of forming a germanium film on a semiconductor substrate that includes the formation of a graded silicon-germanium buffer layer prior to the formation of a germanium layer

Method of forming a germanium film on a semiconductor substrate that includes the formation of a graded silicon-germanium buffer layer prior to the formation of a germanium layer

机译:在半导体衬底上形成锗膜的方法,该方法包括在形成锗层之前形成渐变的硅锗缓冲层

摘要

A composite of germanium film for a semiconductor device and methods of making the same. The method comprises growing a graded germanium film on a semiconductor substrate in a deposition chamber while simultaneously decreasing a deposition temperature and decreasing a silicon source gas and increasing a germanium source gas over a predetermined amount of time. The graded germanium film comprises an ultra-thin silicon-germanium buffer layer and a germanium film.
机译:用于半导体器件的锗膜的复合材料及其制造方法。该方法包括在沉积室中的半导体衬底上生长梯度锗膜,同时在预定的时间内降低沉积温度并降低硅源气体并增加锗源气体。梯度锗膜包括超薄硅锗缓冲层和锗膜。

著录项

  • 公开/公告号US6723622B2

    专利类型

  • 公开/公告日2004-04-20

    原文格式PDF

  • 申请/专利权人 INTEL CORPORATION;

    申请/专利号US20020081099

  • 发明设计人 ANAND MURTHY;BOYAN BOYANOV;RAVINDRA SOMAN;

    申请日2002-02-21

  • 分类号H01L213/65;

  • 国家 US

  • 入库时间 2022-08-21 23:14:05

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