Thin film composite containing a nickel-coated copper substrate and energy storage device containing the same

摘要

The invention relates to a process of preparing a copper/nickel substrate by annealing nickel-coated copper. After the nickel deposition step, a dielectric, such as lead zirconate titanate (PZT), may be deposited onto the substrate by methods known in the art such as sol-gel or vacuum deposition. This invention further relates to thin film composites. These composites include a pre-annealed nickel-coated copper substrate and a dielectric such as PZT.