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Scatterometry techniques to ascertain asymmetry profile of features and generate a feedback or feedforward process control data associated therewith
Scatterometry techniques to ascertain asymmetry profile of features and generate a feedback or feedforward process control data associated therewith
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机译:散射测量技术以确定特征的不对称轮廓,并生成与之相关的反馈或前馈过程控制数据
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摘要
The present invention is directed to a method and a system for non-destructively, efficiently and accurately detecting asymmetry in the profile of a feature formed on a wafer during the process of semiconductor fabrication. The method encompasses directing a beam of light or radiation at a feature and detecting a reflected beam associated therewith. Data associated with the reflected beam is correlated with data associated with known feature profiles to ascertain profile characteristics associated with the feature of interest. Using the profile characteristics, an asymmetry of the feature is determined which is then used to generate feedback or feedforward process control data to compensate for or correct such asymmetry in subsequent processing.
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