首页> 外国专利> METHOD AND APPARATUS FOR DRY-ETCHING HALF-TONE PHASE-SHIFT FILMS HALF-TONE PHASE-SHIFT PHOTOMASKS AND METHOD FOR THE PREPARATION THEREOF AND SEMICONDUCTOR CIRCUITS AND METHOD FOR THE FABRICATION THEREOF

METHOD AND APPARATUS FOR DRY-ETCHING HALF-TONE PHASE-SHIFT FILMS HALF-TONE PHASE-SHIFT PHOTOMASKS AND METHOD FOR THE PREPARATION THEREOF AND SEMICONDUCTOR CIRCUITS AND METHOD FOR THE FABRICATION THEREOF

机译:干蚀刻半色调相移膜的方法和装置,半色调相移膜的制备方法,半导体电路及其制造方法

摘要

A dry-etching method comprises the step of dry-etching a metal thin film as a chromium-containing half-tone phase-shift film, wherein the method is characterized by using, as an etching gas, a mixed gas including (a) a reactive ion etching gas, which contains an oxygen-containing gas and a halogen-containing gas, and (b) a reducing gas added to the gas component (a), in the process for dry-etching the metal thin film. The dry-etching method permits the production of a half-tone phase-shift photomask by forming patterns to be transferred to a wafer on a photomask blank for a chromium-containing half-tone phase-shift mask. The photomask can in turn be used for manufacturing semiconductor circuits. The method permits the decrease of the dimensional difference due to the coexistence of coarse and dense patterns in a plane and the production of a high precision pattern-etched product.
机译:干蚀刻方法包括对金属薄膜作为含铬的半色调相移膜进行干蚀刻的步骤,其中,该方法的特征在于,使用包括以下成分的混合气体作为蚀刻气体:在干蚀刻金属薄膜的过程中,反应性离子蚀刻气体包含含氧气体和含卤素气体,以及(b)添加到气体成分(a)中的还原性气体。干蚀刻法允许通过在用于含铬的半色调相移掩模的光掩模坯上形成要被转印到晶片上的图案来制造半色调相移光掩模。该光掩模又可以用于制造半导体电路。该方法允许由于平面中的粗糙和密集图案的共存而减小尺寸差,并且可以产生高精度的图案蚀刻产品。

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