Provision for the reduction of piezoelectric effects in at least one component sensitive to electrical, piezoelectric Effects, with an active layer of Semiconductor material

摘要

Chip describes a provision for reduction of piezoelectric effects in at least one component (3) to sensitive Electrical effects with a piezoelectric Layer (2) Active semiconductor material, at the same time,This Layer (2) Active semiconductor material comprises at least a First area (2a) with the electrical Component (3) sensitive piezoelectric effects and a Second area (2b) with a number of contacts (6) for the electrical Contact.That is because this Layer (2) Active semiconductor material is United in the area (2b) of the contacts (6) by means of an electrical Contact Material mechanically and electrically and / or thermally with a substrate (5), at the same time,The area (2a) with the component (3) sensitive piezoelectric effects is detached from the substrate (5) and is also free of Electrical Contact.