A multi-layer wiring plate capable of assuring connection between layers with a high reliability and superimposing an outer layer circuit substrate. An inner layer circuit substrate (420) including an adhesive layer (412) having the flux function is attached to both sides of an inner flexible circuit substrate (220). Outer one-side circuit substrates (120) including a conductive posts (107) composed of a copper post (108) and a metal coating layer (1081) are attached to the inner circuit substrates (420). Via the conductive posts (107, 408), predetermined portions of conductive circuits (103, 204, 403) of the respective wiring plates (220, 420, 120) are electrically connected.
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