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CU ECP PLANARIZATION BY INSERTION OF POLYMER TREATMENT STEP BETWEEN GAP FILL AND BULK FILL STEPS
CU ECP PLANARIZATION BY INSERTION OF POLYMER TREATMENT STEP BETWEEN GAP FILL AND BULK FILL STEPS
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机译:通过在间隙填充和批量填充步骤之间插入聚合物处理步骤来进行CU ECP平面化
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摘要
The method generally includes filling features in a substrate by plating metal ions from a gap fill solution onto the substrate, reducing plating activity in the features in a polymer treatment step by conditioning the substrate surface with a conditioning solution, and plating the substrate surface to a desired thickness by plating metal ions from a bulk fill solution onto the substrate surface. The method may also include treating the substrate with a conditioning solution comprising suppressors after a seed layer deposition to substantially eliminate conformal deposition in features of the substrate and plating metal ions from a plating solution onto the substrate.
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