Paste to be fired for forming circuit board and method for preparing surface-modified silver powder

摘要

A paste to be fired at a temperature lower than melting point of silver for forming a circuit board comprising surface-modified silver powder consisting essentially of metal silver particles having an average particle size of not more than 10 µm and at least one member selected from the group consisting of oxides and double oxides containing at least one metal element selected from the group consisting of those belonging to Groups 2 to 14 of Periodic Table whose atomic number falls within the range of from 12 to 82, which is adhered to the surface of the individual metal silver particles. The surface-modified silver powder has an elevated sintering-initiation temperature and a reduced rate of heat shrinkage due to sintering. Therefore, the surface-modified silver powder is particularly suitable for use in making a circuit board, in particular an LTCC circuit board.