Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28) in hydraulic communication with a peripheral condenser (30), both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator (28) substantially full at all orientations while leaving a void for accumulation of vapor in the condenser (30). A cover plate (24) and a parallel base plate (22) of generally similar dimension form the evaporator (28) and condenser (30). Optionally, an opening in the base plate (22) is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate (22) may be formed with the electronics package from a single piece of material. A boiling enhancement structure (34)is provided in the evaporator (30) to encourage vapor bubble nucleation.
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