Providing high precision resistance in an integrated circuit using a thin film resistor of controlled dimension

摘要

In one embodiment, an integrated circuit (10) includes a thin film resistor (12), which includes a resistor material that has been deposited on a substrate surface (14) within a channel (86) defined by opposing first and second portions (88) of a stencil structure (80a) formed on the substrate surface (14), the resistor material having an initial width determined by a width of the channel (86). The stencil structure (80a) has been adapted to receive a planarizing material that protects against reduction of the initial width of the resistor material during subsequent process steps for removing the stencil structure (80a). A head mask (22) overlays an end portion of the thin film resistor (12) and a dielectric (24) overlays the head mask (22), the dielectric (24) defming a via (28) formed in the dielectric (24) above a portion (26) of the head mask (22). A conductive material (30) has been deposited in the via (28), coupled to the portion (26) of the head mask (22) and electrically connecting the thin film resistor (12) to other components of the integrated circuit (10).