首页> 外国专利> INTRINSIC BIREFRINGENCE COMPENSATION FOR BELOW 200 NANOMETER WAVELENGTH OPTICAL LITHOGRAPHY COMPONENTS WITH CUBIC CRYSTALLINE STRUCTURES

INTRINSIC BIREFRINGENCE COMPENSATION FOR BELOW 200 NANOMETER WAVELENGTH OPTICAL LITHOGRAPHY COMPONENTS WITH CUBIC CRYSTALLINE STRUCTURES

机译:具有立方晶体结构的200纳米以下波长光学光刻技术组件的内在双折射补偿

摘要

Stress-induced photoelastic birefringence compensates for intrinsic birefringence of cubic crystalline structures (12) in deep ultraviolet (less than 200 nm) microlithographic imaging systems (10). Both the photoelastic birefringence and the intrinsic birefringence are expressed in a tensor format simplified by the symmetries of cubic crystalline structures. The stress-induced photoelastic birefringence can be sized to individually compensate for intrinsic birefringence exhibited in the same optical elements or preferably to collectively compensate for the cumulative effects of intrinsic birefringence in other optical elements in the lithography system.
机译:应力诱导的光弹性双折射补偿了深紫外(小于200 nm)微光刻成像系统(10)中立方晶体结构(12)的固有双折射。光弹性双折射和固有双折射均以张量格式表示,该张量格式通过立方晶体结构的对称性简化。应力引起的光弹性双折射的尺寸可以确定为单独补偿在相同光学元件中表现出的固有双折射,或者优选地集体补偿光刻系统中其他光学元件中固有双折射的累积效应。

著录项

  • 公开/公告号EP1417530A1

    专利类型

  • 公开/公告日2004-05-12

    原文格式PDF

  • 申请/专利权人 CORNING INCORPORATED;

    申请/专利号EP20020750066

  • 申请日2002-07-16

  • 分类号G02B27/14;G02F1/07;G02F1/1333;G01J4/00;G01R33/02;H01J40/14;G01L1/24;

  • 国家 EP

  • 入库时间 2022-08-21 22:52:34

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