首页> 外国专利> ULTRASONIC BONDING DEVICE, PROMOTING OPTIMIZATION OF POSITION FOR FITTED ARTICLE TO BE PROCESSED

ULTRASONIC BONDING DEVICE, PROMOTING OPTIMIZATION OF POSITION FOR FITTED ARTICLE TO BE PROCESSED

机译:超声波键合装置,促进对适合的关节的位置的优化

摘要

PURPOSE: An ultrasonic bonding device is provided to promote simplification of a change of bonding active faces and to promote optimization of position of a mounting stand. CONSTITUTION: In an ultrasonic bonding device, a resonator(4) mounted on a holder(3) installed to a pressing unit and a portion in a mounting device(7) where plural articles to be processed are superposed are fitted, and the superposed portion is joined by ultrasonic vibration by the resonator. The holder has a rotating support unit(5) and an angle indexing unit. The resonator having plural bonding active faces(8) is rotatably mounted on the rotating support unit with an axial center of a vibration transmission direction as a center of rotation. In the angle indexing unit, the resonator is fixed at a circumferential allocated angle having the axial center of the vibration transmission direction as the center.
机译:用途:提供了一种超声粘合装置,以简化粘合活动面的变化并促进安装架位置的优化。组成:在超声焊接装置中,安装在安装在压制单元的支架(3)上的谐振器(4)和安装装置(7)中要处理的多个物品叠置的部分上,并叠置部分由谐振器通过超声波振动而接合。保持器具有旋转支撑单元(5)和角度分度单元。具有多个接合有效面(8)的谐振器以振动传递方向的轴心为旋转中心而可旋转地安装在旋转支撑单元上。在角度分度单元中,将谐振器固定在以振动传播方向的轴向中心为中心的周向分配角度。

著录项

  • 公开/公告号KR20040031595A

    专利类型

  • 公开/公告日2004-04-13

    原文格式PDF

  • 申请/专利权人 ULTEX CORPORATION;

    申请/专利号KR20030067883

  • 发明设计人 SATO SHIGERU;NAKAI SEIYA;

    申请日2003-09-30

  • 分类号B23K20/10;

  • 国家 KR

  • 入库时间 2022-08-21 22:49:18

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号