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ULTRASONIC BONDING DEVICE, PROMOTING OPTIMIZATION OF POSITION FOR FITTED ARTICLE TO BE PROCESSED
ULTRASONIC BONDING DEVICE, PROMOTING OPTIMIZATION OF POSITION FOR FITTED ARTICLE TO BE PROCESSED
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机译:超声波键合装置,促进对适合的关节的位置的优化
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摘要
PURPOSE: An ultrasonic bonding device is provided to promote simplification of a change of bonding active faces and to promote optimization of position of a mounting stand. CONSTITUTION: In an ultrasonic bonding device, a resonator(4) mounted on a holder(3) installed to a pressing unit and a portion in a mounting device(7) where plural articles to be processed are superposed are fitted, and the superposed portion is joined by ultrasonic vibration by the resonator. The holder has a rotating support unit(5) and an angle indexing unit. The resonator having plural bonding active faces(8) is rotatably mounted on the rotating support unit with an axial center of a vibration transmission direction as a center of rotation. In the angle indexing unit, the resonator is fixed at a circumferential allocated angle having the axial center of the vibration transmission direction as the center.
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