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WET CHEMICAL PROCESSING METHOD AND APPARATUS OF SILICON FOR REDUCING PROCESSING COST
WET CHEMICAL PROCESSING METHOD AND APPARATUS OF SILICON FOR REDUCING PROCESSING COST
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机译:用于降低加工成本的硅湿法加工方法和装置
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摘要
PURPOSE: A wet chemical processing method and apparatus of silicon are provided to reduce processing cost by recycling partially oxynitride using a connection line. CONSTITUTION: An etchant(4) containing water, nitric acid, and hydrofluoric acid is activated by using oxynitride. The oxynitride is NO, NO2, N2O4, or a mixed compound thereof. The oxynitride is added to the etchant until the etchant is saturated. Wet chemical processing is performed on silicon in a first container(1) by using the activated etchant. The oxynitride is exhausted from the first container. The oxynitride is partially added to another etchant(5) of a second container(2) through a connection line(8).
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机译:目的:提供一种湿法化学处理硅的方法和装置,以通过使用连接线回收部分氮氧化物来降低处理成本。组成:一种含有水,硝酸和氢氟酸的蚀刻剂(4)是通过使用氮氧化物活化的。氧氮化物是NO,NO 2,N 2 O 4或它们的混合化合物。将氮氧化物添加到蚀刻剂中,直到蚀刻剂饱和为止。使用活化的蚀刻剂对第一容器(1)中的硅进行湿化学处理。氮氧化物从第一容器中排出。通过连接线(8)将氧氮化物部分地添加到第二容器(2)的另一蚀刻剂(5)中。
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