METHOD FOR FORMING PLATING LAYER ON PRINTED CIRCUIT BOARD OR CERAMIC SUBSTRATE AND METHOD FOR FABRICATING CHIP TYPE ELECTRONIC COMPONENT HAVING EXTERNAL ELECTRODE

摘要

PURPOSE: A method for forming a plating layer on a printed circuit board or a ceramic substrate and a method for fabricating a chip type electronic component having an external electrode are provided to form easily a wiring pattern and an external electrode by using a soluble coating layer. CONSTITUTION: A coating layer(10) of ink paint is formed on a surface of a component element having a base layer for a wiring pattern. The ink paint is soluble in a rinsing solution including alcohol. The coating layer formed on the base layer is removed entirely or partially therefrom. An electroless plating layer is formed on the surface of the component element. The component element having the electroless plating layer is rinsed by using the rinsing solution in order to remove the coating layer and the electroless plating layer attached on the coating layer.