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COMPACT ELECTRONIC DEVICE HAVING PACKAGE STRUCTURE SUITABLE FOR HERMETICALLY SEALING SURFACE ACOUSTIC WAVE CHIP AND PACKAGE USED THEREFOR
COMPACT ELECTRONIC DEVICE HAVING PACKAGE STRUCTURE SUITABLE FOR HERMETICALLY SEALING SURFACE ACOUSTIC WAVE CHIP AND PACKAGE USED THEREFOR
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机译:具有适合于气密密封表面声波芯片的封装结构的紧凑型电子设备,并采用了这种封装
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摘要
PURPOSE: A compact electronic device having a package structure suitable for hermetically sealing a surface acoustic wave chip and a package used therefor are provided to stabilize a mounting structure by miniaturizing electronic components in a state of supporting a chip from a backside. CONSTITUTION: A compact electronic device includes a package, a chip, first external terminals, and a plate member. The package has a metal part shaped by pressing a metal member and an insulator part bonded to the metal part through fusing. The chip is housed in the package. The first external terminals(20) are electrically connected to the chip and are buried in the insulator part in order to be arranged in a line. The plate member(15) is used for supporting the chip from a backside thereof. The metal parts have recess parts(19) to define second external terminals. The plate member is provided to cover the recess parts.
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