STACK CHIP PACKAGE USING WIRING BOARD TO ACHIEVE STABLY ELECTRICAL CONNECTION BETWEEN CHIPS AND PCB

摘要

PURPOSE: A stack chip package is provided to achieve stably the electrical connection between chips and a PCB(Printed Circuit Board) by using wiring boards. CONSTITUTION: A stack chip package(100) includes a PCB, a plurality of semiconductor chips(50,60) with chip pads, wiring boards(30,130) for connecting electrically the semiconductor chips with the PCB, a resin encapsulation part(80) for sealing selectively the stack chip package, and solder balls(90) formed on the PCB. Each wiring board includes a non-conducting tape and a pattern lead(132). The non-conducting tape includes a chip attaching part(134) and a wire insulating part(135). The pattern lead includes a chip bonding portion(138) and a PCB bonding portion(139).