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METHOD FOR FORMING ANTISTATIC LAYER OF DUMMY TAPE BY PERFORMING SPUTTERING, PLASMA, OR ION BEAM TREATMENT ONTO SURFACE OF FILM UNDER INERT GAS ATMOSPHERE
METHOD FOR FORMING ANTISTATIC LAYER OF DUMMY TAPE BY PERFORMING SPUTTERING, PLASMA, OR ION BEAM TREATMENT ONTO SURFACE OF FILM UNDER INERT GAS ATMOSPHERE
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机译:通过在惰性气体气氛下对膜表面进行溅射,等离子体或离子束处理来形成钝化胶带的防静电层的方法
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摘要
PURPOSE: A method is provided to use a film for a dummy tape as a lead film of a flexible printed circuit board by permitting the film to maintain antistatic properties even at a high temperature of 150 to 200 Deg.C. CONSTITUTION: A method is characterized in that an antistatic layer of a dummy tape is formed by coating a conductive disperse solution on the surface of the film for the dummy tape. Alternatively, an antistatic layer of a dummy tape is formed by performing a sputtering, plasma, or ion beam treatment of aluminum, chrome, or copper metal onto the surface of the film under the inert gas atmosphere of one selected from a group consisting of nitrogen, argon, and neon. The film is selected from a group consisting of polyimide, polyether imide, polyamide imide, polyethylene naphthalate, polyether ether ketone, polyethylene terephthalate, and polyether sulfone.
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