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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF CHEMICAL MECHANICAL POLISHING
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF CHEMICAL MECHANICAL POLISHING
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机译:用于制造化学机械抛光的相同装置和装置的半导体装置和方法以及化学机械抛光的方法
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摘要
The present invention provides a semiconductor device which can prevent the oxidization of the surfaces of pad electrodes to enhance the connecting strength between the pad electrodes and external terminals. The semiconductor device according to the present invention comprises pad electrodes for use in connecting external electrodes and a multilayer wiring structure connected to the pad electrodes, wherein one surface of an insulating layer covering the pad electrodes and having openings over the pad electrodes for exposing the surfaces of the pad electrodes is in contact with a metal layer formed from one selected from precious metals and alloys containing the precious metals as main components.
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