首页> 外国专利> METHOD FOR FABRICATING PZT THIN FILM TO REDUCE DEFECT AND FORM THIN FILM STRUCTURE MADE OF ONLY PURE PEROVSKITE

METHOD FOR FABRICATING PZT THIN FILM TO REDUCE DEFECT AND FORM THIN FILM STRUCTURE MADE OF ONLY PURE PEROVSKITE

机译:制造PZT薄膜以减少仅纯钙钛矿制成的缺陷并形成薄膜结构的方法

摘要

PURPOSE: A method for fabricating a PZT(PbZrxTix-1O3) thin film is provided to reduce a defect and form a thin film structure made of only pure perovskite by forming a PZT thin film by a MOCVD(metal organic chemical vapor deposition) method. CONSTITUTION: An electrode(52) is formed on a substrate(51). A PZT initial thin film(54) is formed on the electrode. A PZT later thin film(56) is formed on the initial thin film. The PZT initial and later thin films are formed by a MOCVD method. A mixture gas of Pb, Zr and Ti that has a value (Pb/(Zr+Ti)1) in which the density of Pb is relatively greater than the sum of the density of Zr and Ti is used as a raw material gas(57) supplied for forming the PZT initial thin film.
机译:目的:提供一种制造PZT(PbZrxTix-1O3)薄膜的方法,以通过MOCVD(金属有机化学气相沉积)方法形成PZT薄膜来减少缺陷并形成仅由纯钙钛矿制成的薄膜结构。组成:电极(52)形成在基板(51)上。在电极上形成PZT初始薄膜(54)。在初始薄膜上形成PZT后薄膜(56)。通过MOCVD方法形成PZT初始和随后的薄膜。使用具有Pb密度相对大于Zr和Ti密度之和的值(Pb /(Zr + Ti)> 1)的Pb,Zr和Ti的混合气体作为原料气体(57)用于形成PZT初始薄膜。

著录项

  • 公开/公告号KR100438809B1

    专利类型

  • 公开/公告日2004-06-24

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR19970062034

  • 发明设计人 KIM DAE SIK;

    申请日1997-11-21

  • 分类号H01L41/16;H01L21/20;G11C11/22;

  • 国家 KR

  • 入库时间 2022-08-21 22:46:54

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