首页> 外国专利> VACUUM PROCESSING APPARATUS FOR COPING WITH LARGER DIAMETER SAMPLES WHILE KEEPING MANUFACTURING COST TO MINIMUM AND SEMICONDUCTOR MANUFACTURING LINE USING THE SAME

VACUUM PROCESSING APPARATUS FOR COPING WITH LARGER DIAMETER SAMPLES WHILE KEEPING MANUFACTURING COST TO MINIMUM AND SEMICONDUCTOR MANUFACTURING LINE USING THE SAME

机译:真空处理装置,用于在保持制造成本至最低的同时处理较大直径的样品,并使用相同的制造线

摘要

PURPOSE: A vacuum processing apparatus and a semiconductor manufacturing line using the same are provided to cope with larger diameter samples, restrict increase of manufacturing cost, and acquire at the same time better maintainability. CONSTITUTION: A cassette block(1) includes a first conveying unit(9) into which a plurality of cassettes(12) including samples are loaded. A first vacuum process block(2) includes first load lock chambers connected to the cassette block, a first vacuum process chamber, a second conveying unit for conveying the samples between the first load lock chamber and the first vacuum process chamber. A second vacuum process block includes second load lock chambers connected to the cassette block, a second vacuum process chamber, a third conveying unit for conveying the samples between the second load lock chamber and the second vacuum process chamber. The first conveying unit conveys the samples among one cassette, the first load lock chambers, and the second load lock chambers.
机译:目的:提供真空处理设备和使用该真空处理设备的半导体生产线,以应对较大直径的样品,限制制造成本的增加,并同时获得更好的可维护性。组成:一个盒子(1)包括一个第一输送单元(9),其中装有样品的多个盒子(12)被装入其中。第一真空处理块(2)包括连接至盒块的第一加载锁定室,第一真空处理室,用于在第一加载锁定室和第一真空处理室之间传输样本的第二传输单元。第二真空处理块包括连接到盒块的第二加载锁定室,第二真空处理室,用于在第二加载锁定室和第二真空处理室之间传输样品的第三传输单元。第一输送单元在一个盒,第一装载锁定室和第二装载锁定室之间传送样品。

著录项

  • 公开/公告号KR100453276B1

    专利类型

  • 公开/公告日2004-10-07

    原文格式PDF

  • 申请/专利权人 HITACHI LTD.;

    申请/专利号KR20010042712

  • 申请日2001-07-16

  • 分类号H01L21/02;

  • 国家 KR

  • 入库时间 2022-08-21 22:46:32

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