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METHOD FOR PRODUCING OHMIC CONTACTS IN THIN-FILM DEVICES BUILT AROUND AMORPHOUS HYDROGENATED SEMICONDUCTORS

机译:在非晶态加氢半导体周围薄膜器件中产生热接触的方法

摘要

FIELD: electronic engineering and microelectronics. SUBSTANCE: proposed method intended to produce ohmic contacts in thin-film field-effect transistors, memory items, Schottky-barrier solar cells, and other pieces of equipment built around amorphous hydrogenated silicon, then a-Si:H, or other hydrogenated amorphous semiconductors is characterized in that operations involved in doping contact film using toxic and explosive gases phosphine and diborane are eliminated and replaced by film annealing prior to coating it with masking insulation and metal electrodes. Semiconductor film is annealed at temperature of hydrogen effusion from film surface within 20 to 30 minutes. EFFECT: reduced toxicity and explosion hazard of process; facilitated procedure. 1 cl, 2 dwg
机译:领域:电子工程和微电子学。物质:拟在薄膜场效应晶体管,存储器,肖特基势垒太阳能电池和其他以非晶态氢化硅,然后是a-Si:H或其他氢化非晶态半导体制造的设备中产生欧姆接触的方法其特征在于,消除了使用有毒和爆炸性气体掺杂膦和乙硼烷掺杂接触膜所涉及的操作,并在用掩蔽绝缘层和金属电极进行涂覆之前通过膜退火来代替。半导体膜在20-30分钟内在氢从膜表面渗出的温度下退火。效果:降低了过程的毒性和爆炸危险;便利的程序。 1厘升2载重吨

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