首页> 外国专利> device for the removal of the resist formulation with u043fu043bu0430u0437u043cu043eu0445u0438u043cu0438u0447u0435u0441u043au043eu0433u043e semiconductor wafers

device for the removal of the resist formulation with u043fu043bu0430u0437u043cu043eu0445u0438u043cu0438u0447u0435u0441u043au043eu0433u043e semiconductor wafers

机译:用于去除抗蚀剂配方的设备,其半导体晶片为

摘要

device for the removal of the resist formulation with u043fu043bu0430u0437u043cu043eu0445u0438u043cu0438u0447u0435u0441u043au043eu0433u043e semiconductor wafers containing hf generator, u0430u043au0442u0438u0432u0430u0446u0438u043eu043du043du0443u044e cell in the form of a tube of u0434u0438u044du043bu0435u043au0442u0440u0438u0447u0435u0441u043au043e the material system of a gas discharge tube which is located in the top of the overlap of working gas, and the reaction chamber with u0442u0435u0440u043cu043eu0441u0442u0430u0431u0438u043bu0438u0437u0438u0440u043eu0432u0430u043du043du044bu043c u043fu043eu0434u043bu043eu0436u043au043eu0434u0435u0440u0436u0430u0442u0435u043bu0435u043c installed under the chamber outside the zone of gas discharge.different topics, with the aim of improving the speed of removing the resist formulation and the quality of processed wafers, u0430u043au0442u0438u0432u0430u0446u0438u043eu043du043du0430u044f chamber provided with at least one complement u0435u043bu044cu043du043eu0439 tube of equal diameter, the excitation system is done in a two u043fu043bu043eu0441u043au043eu043fu0430u0440u0430u043bu043bu0435u043bu044cu043du044bu0445 electrodes with holes in which the installed pipes u0430u043au0442u0438u0432u0430u0446u0438u043eu043du043du043e two camerasthe pipes are placed symmetrically about the center u043fu043eu0434u043bu043eu0436u043au043eu0434u0435u0440u0436u0430u0442u0435u043bu044f, with the electrode on the u043fu0430u0442u0440u0443u0431u043au0443 overlap strip electrode on the ground. u043fu043eu0434u043bu043eu0436u043au043eu0434u0435u0440u0436u0430u0442u0435u043bu044e, is connected to the hf generator and is located at a distance l from the u043fu043eu0434u043bu043eu0436u043au043eu0434u0435u0440u0436u0430u0442u0435u043bu044f determined from u0441u043eu043eu0442u043du043eu0448u0435u043du0438u044f2,1 Du2264lu226421 d and the distance h between the electro dami is located within the 3u2264hu22642,1 d, mm, where d is the inner diameter of the pipe.mm.
机译:u043f u043b u0430 u0437 u043c u043e u0445 u0438 u043c u0438 u0447 u0435 u0441 u043a u043e u0433 u043e包含高频发生器的半导体晶圆的去除装置, u0430 u043a u0442 u0438 u0432 u0430 u0446 u0438 u043e u043d u043d u043d u0443 u044e细胞为 u0434 u0438 u044d u043b u0435 u043a u0442 u0440 u04e u0438 u0447 u0435 u0441 u043a u043e位于工作气体重叠的顶部的排气管的材料系统,以及带有 u0442 u0435 u0440 u043c u043e u0441 u0442 u0430 u0431 u0438 u043b u0438 u0437 u0438 u0440 u043e u0432 u0430 u043d u043d u044b u043c u043f u043e u0434 u043b u043b u043e u0436 u043a u043e u043e u0435 u0440 u0436 u0430 u0442 u0435 u043b u0435 u043c安装在气体排放区域外的腔室下方。不同的主题,旨在提高去除抗蚀剂配方的速度和已加工晶圆的质量, u0430 u043a u0442 u0438 u0432 u0430 u04 46 u0438 u043e u043d u043d u0430 u044f腔室装有至少一根直径相等的补体 u0435 u043b u044c u043d u043e u0439管,激励系统在两个 u043f u043b 中完成u043e u0441 u043a u043e u043f u0430 u0440 u0430 u043b u043b u0435 u043b u044c u043d u044b u0445带孔的电极,其中已安装管道 u0430 u043a u0442 u0438 u0432 u0430 u0446 u0438 u043e u043d u043d u043e两个管道围绕中心对称放置 u043f u043e u0434 u043b u043e u0436 u043a u043e u0434 u0435 u045 u0440 u0436 u0430 u0442 u0435 u043b u044f,且电极位于 u043f u0430 u0442 u0440 u0443 u0431 u043a u0443与条形电极重叠在地面上。 u043f u043e u0434 u043b u043e u0436 u043a u043e u0434 u0435 u0440 u0436 u0430 u0442 u0435 u043b u044e连接到hf发生器,并且与hf发生器的距离为l u043f u043e u0434 u043b u043e u0436 u043a u043e u0434 u0435 u0440 u0436 u0430 u0442 u0435 u043b u044b从 u0441 u043e u043e u043e u0442 u043d u043e 0确定 u0435 u043d u0438 u044f2,1 D u2264l u226421 d和电dami之间的距离h位于3 u2264h u22642,1 d,mm之内,其中d是管道的内径。mm 。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号