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MOS power transistor has one or more gate zones, each between source and drain or bulk node zones; each bulk node zone is arranged separately from one or more source electrode zones
MOS power transistor has one or more gate zones, each between source and drain or bulk node zones; each bulk node zone is arranged separately from one or more source electrode zones
The device has a source electrode zone(s) of a first conducting type in an n-conducting semiconducting zone in a p-conducting substrate region, a drain electrode zone(s) of this type, a gate electrode zone(s) of a second conducting type and at least one highly doped bulk node of the second type with each gate zone between a source and a drain of bulk node zone. Each bulk node zone is arranged separately from one or more source electrode zone. The device has at least one source electrode zone (S) of a first conducting type in an n-conducting semiconducting zone (11) in a p-conducting substrate region (10), at least one drain electrode zone (D) of this type, at least one gate electrode zone (G) of a second conducting type and at least one highly doped bulk node (B) of the second type with each gate zone between a source and a drain of bulk node zone. Each bulk node zone is arranged separately from one or more source electrode zone.
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