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A method for the production of group - ii - oxide layers with the gas phase epitaxy, group - ii - oxide layer and group - ii - oxide semiconductor device

机译:一种具有气相外延的第ii族氧化物层,第ii族氧化物层和第ii族氧化物半导体器件的制造方法

摘要

In the production of group II oxide films by gas phase epitaxy, a buffer layer is deposited at a lower temperature than the main layer in the same growth chamber and oxygen precursors of the type water and/or organic nitroso, ketone and/or ether compound(s) are used for growth of the buffer layer. In the production of group II oxide films by gas phase epitaxy, a buffer layer is deposited at a lower temperature than the main layer in the same growth chamber and oxygen precursors of the type H-O-H, NO-R, O=R and/or R-O-R (where R = any organic group) are used for growth of the buffer layer. Independent claims are also included for: (a) group II oxide film produced in this way; (b) group II oxide semiconductor device with the specified buffer and main layers, which has an n-p junction obtained by doping with main group III elements and a p-type layer with main group V elements.
机译:在通过气相外延制备II族氧化物膜时,在比主层更低的温度下在同一生长室中沉积缓冲层,并沉积水和/或有机亚硝基,酮和/或醚类化合物的氧前体(一个或多个)用于缓冲层的生长。在通过气相外延制备II族氧化物膜时,在比生长层中的主层低的温度下沉积缓冲层,并且在HOH,NO-R,O = R和/或ROR类型的氧前体中沉积缓冲层(其中R =任何有机基团)用于缓冲层的生长。还包括以下方面的独立权利要求:(a)以这种方式生产的II族氧化膜; (b)具有指定的缓冲层和主层的II族氧化物半导体器件,其具有通过掺杂主III族元素和具有主V族元素的p型层而获得的n-p结。

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