Integrated switching arrangement comprises a metallization layer, a conducting pathway dielectric, a conducting pathway intermediate material, conducting connecting sections, dielectric, and connecting section intermediate material

摘要

Integrated switching arrangement (10) comprises a metallization layer (16) containing electrically conducting pathways (14), a conducting pathway dielectric (18) between the conducting pathways, an electrically conducting pathway intermediate material (20) arranged on a side surface (40) of a conducting pathway and dielectric, electrically conducting connecting sections (12), a connecting dielectric (24) between the connecting sections, and connecting section intermediate material (28) arranged between a connecting section and the dielectric and/or between a connecting section and a conducting pathway. Independent claims are also included for the following: (1) Process for the production of design data for the manufacture of the integrated switching arrangement; (2) Program used in the design production process; and (3) Device, especially a data processing device, for producing design data.