Process for cleaning electronic circuit boards comprises feeding a carrier gas under pressure through a jet line to a jet nozzle, introducing liquid carbon dioxide via a feed line, converting into dry snow, and injecting into the jet line

摘要

Process for cleaning electronic circuit boards comprises feeding a carrier gas under pressure through a jet line (10) to a jet nozzle (14), introducing liquid CO2 via a feed line (32), converting into dry snow, and injecting into the jet line. The CO2 is fed from the feed line into the jet line via a stress-relieving chamber (34). The equation V1/3/A1/2 10 is fulfilled, in which V is the volume of the stress-relieving chamber and A is the inner cross-sectional surface of the feed line. An Independent claim is also included for a device for carrying out the process. Preferred Features: The length LE of the stress-relieving chamber is at least 80 mm. The throughput of carrier gas through the jet line is at least 1 m3/min.. The carrier gas has a pressure of at least 0.1 MPa, preferably approximately 1.0 MPa.