Process for treating wafers comprises covering the front side of the wafer having components with a layer system consisting of a separating layer and a protective layer before the rear side of the wafer is coated

摘要

Process for treating wafers comprises covering the front side of the wafer (1) having components (2) with a layer system consisting of a separating layer (3) and a protective layer (4). The wafer and the components are protected by the layer system during coating of the rear side of the wafer. An Independent claim is also included for a device for carrying out the process.