Process for applying solder material, use of a system for laser-assisted direct metal deposition therefor and contact areas with solder deposits

摘要

The invention relates to a method in which a solder depot is formed on a contact surface (12), for example of a circuit carrier (11), in that a beam (13) of solder powder particles (14) is directed onto the contact surface (12) and the solder powder particles (14 ) are at least melted, in particular by a laser beam (15) during or shortly after being fed onto the contact surface (12). By deliberately moving the solder powder jet (13) and the laser beam (15), solder deposits with any geometry, in particular with widely differing volumes, can be produced in one operation on the various contact surfaces of the circuit carrier (11). In this way, solder deposits with a very small volume (e.g. for flip chips) and with a very large volume (e.g. for capacitors and resistors) can advantageously be combined with one another on the circuit carrier. The invention further relates to solder deposits with a porous or layered structure, which can be produced in particular with the aforementioned method. In addition, the invention relates to the use of a LADMD system (Laser aided metal deposition) for the described method.