Semiconductor chip stack manufacturing method incorporates bridging of conductor paths of one semiconductor chip for design modification

摘要

The manufacturing method has a pair of semiconductor chips (11,12) each provided with metallized layer contact surfaces (21), covered with an insulation layer (22) in which through contact openings are formed for connection with conductor paths (3,23). The surface of one of the semiconductor chips provided with the conductor paths also has a conductor path (13) bridged by covering it with an insulation layer (14) provided with a bridging conductor path layer (20).