Multilayer printed circuit board, a process for their production and multilayer printed circuit board using a mobile device

摘要

A plurality of one-sided conductor path films, which is made of resin films are produced, is stacked on top of one another, in order to form a stack, wherein in a given region of a release film is arranged in between, which can easily can be separated from the resin films. The stack is then heated and is placed under pressure, in order to form a multilayer printed circuit board (8). After the assembly of components on the surface of the multilayer printed circuit board, the printed circuit board and the release film detached from one another. At least one separation plate (10a) of separation plates (10a, 10b) is then at an angle relative to a position in front of detachment folded. Components (9b, 9c, 9d) are mounted on the separate surfaces of the separation plates mounted. Thus, a renewed installation of the components on the separate surfaces of the separation plates a high-density mounting, without the surfaces dimensions of the plurality of layers of itself be enlarged and without an additional printed circuit board to add.