首页> 外国专利> Semiconductor pressure sensor has its sensor element mounted so that it faces towards a sensor mounting circuit board, thus prevent light acting on the sensor element

Semiconductor pressure sensor has its sensor element mounted so that it faces towards a sensor mounting circuit board, thus prevent light acting on the sensor element

机译:半导体压力传感器的传感器元件安装为面向传感器安装电路板,因此可以防止光线作用于传感器元件

摘要

Pressure sensor arrangement has a housing (10) with an open side (11) in its surface and a sensor element (20) mounted in the open side for measurement of an external pressure outside the housing. The housing is attached to an attachment part (30) in the form of a circuit board. The housing is attached to the circuit board such that the pressure sensor is opposite to it. The invention also relates to a corresponding method of manufacture for a pressure sensor assembly.
机译:压力传感器装置具有在其表面上具有开口侧(11)的壳体(10)和安装在该开口侧中的传感器元件(20),用于测量壳体外部的外部压力。壳体以电路板的形式安装在安装部(30)上。外壳连接到电路板上,使得压力传感器与之相对。本发明还涉及用于压力传感器组件的相应的制造方法。

著录项

  • 公开/公告号DE10360972A1

    专利类型

  • 公开/公告日2004-07-15

    原文格式PDF

  • 申请/专利权人 DENSO CORP. KARIYA;

    申请/专利号DE2003160972

  • 发明设计人 NOMURA TAKASHI;HORIBA KEIJI;FUJII TETSUO;

    申请日2003-12-23

  • 分类号G01L19/14;

  • 国家 DE

  • 入库时间 2022-08-21 22:43:13

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