Sputtering device useful for production of thin dielectric films for optical devices and mixed films, includes a vacuum chamber, a cylindrical rotatable substrate holder in the generator and two film deposition regions

摘要

A sputtering device including a vacuum chamber (1), a cylindrical rotatable substrate holder (9) in the generator, a substrate mounted on the outer periphery of the substrate holder, two film deposition regions in the vacuum chamber, first and second sputtering sources (35,36), targets, cathodes, and plasma generators (51,52), with the first sputtering source and plasma generator and the second sputtering source and generator respectively separated from each other. An independent claim is included for a mixed film applied to a substrate by a sputtering device with repetition of the following process:sputtering of a film from a first target material onto the substrate from a first target source, production of a reaction of the film formed by a first plasma generator, deposition of a film from a second target material from a second sputtering source, and production of a reaction of the film formed by a second plasma generator.