METHOD FOR DETECTING JUMP-OUT FROM RETAINING MEMBER OF WAFER, METHOD FOR DETECTING PARTIAL CRACK IN WAFER, METHOD FOR DETECTING JUMP-OUT OF WAFER IN CMP APPARATUS, METHOD FOR DETECTING PARTIAL CRACK IN WAFER IN CMP DEVICE, AND METHOD FOR DETECTING PARTIAL JUMP-OUT FROM RETAINING MEMBER OF WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method for detecting the jump-out and partial cracks of wafers, without having to provide special sensors.;SOLUTION: Light applied from a light source 7 of a polishing end point detector is reflected on the surface of the wafer 2 through a beam splitter 8. The reflection light is reflected by the beam splitter 8 and is dispersed by a spectrograph 9. The spectral reflection factor of the wafer 2 is measured, and the polishing end point is detected based on it. When the wafer 2 jump out occurs, the spectral reflection factor of the surface of a wafer holder 1 is detected. The spectral reflection factor very much differs from that the normal wafer 2 has and is detected as an abnormal value in an arithmetic unit 6. Thus, when the abnormal value is detected, it is considered that the wafer 2 has jumped out.;COPYRIGHT: (C)2005,JPO&NCIPI